MIL-DTL-9419G
3.5.10 Shock. When switches are tested as specified in 4.7.12, the opening or closing of contacts
shall not exceed 10 microseconds.
3.5.11 Acceleration. When switches are tested as specified in 4.7.13, there shall be no closure of
open contacts.
3.4.12 Moisture resistance. When switches are tested as specified in 4.7.14, there shall be no
electrical or mechanical failures and the switches shall meet dielectric withstanding voltage test specified
herein.
3.5.13 Thermal shock. When switches are tested as specified in 4.7.15, there shall be no electrical or
mechanical damage.
3.5.14 Altitude. When switches are tested as specified in 4.7.16, there shall be no electrical or
mechanical damage.
3.5.15 Salt spray. When switches are tested as specified in 4.7.17, there shall be no electrical failures,
or breaking, spalling, cracking, or loosening of terminals.
3.5.16 Fungus. When switches are tested as specified in 4.7.18, there shall be no electrical or
mechanical damage. This test may be waived by the preparing activity provided suitable evidence is
provided that all materials used (such as fungus inert or treated) are non-nutrient.
3.5.17 Solderability (applicable to solderable terminations).
3.5.17.1 Small wire. When switches with solid wire terminations of .045 maximum diameter or
stranded wire terminations of number 18 AWG or smaller are tested as specified in 4.7.19, the dipped
surface of the termination:
a.
Shall be at least 95 percent covered by a continuous new solder coating.
b. Shall not have pinholes or voids that are concentrated in one area or that exceed 5 percent of the
total area.
3.5.17.2 Large wire. When switches with solder terminals, solid wire terminations greater than .045
diameter, and stranded wire terminations larger than number 18 AWG are tested as specified in 4.7.19,
the dipped surface of the terminations:
a. Shall have 95 percent of the total length of the filet, which is between the standard wire wrap and
the termination, tangent to the surface of the termination being tested and shall be free from
pinholes and voids.
b. Shall not have a ragged or interrupted line at the point of tangency between the filet and the
termination under test.
3.5.18 Resistance to soldering heat (applicable to switches with solderable terminals) (not applicable
to switches with integral lead wire terminals). When switches are tested as specified in 4.7.20, switches
shall meet the switch resistance requirement, and there shall be no deformation or other damage at the
conclusion of the test sequence.
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