MIL-PRF-22885 Switches, Push Button, Illuminated, General Specification ForThis specification covers the general requirements for manually operated illuminated push button switches, switch assemblies \(see 6.4.1\), and associated modular subassemblies. As used in this specification, the term "switches" should include the associated modular subassemblies, including switches, indicator lights, actuators, lenses, color filters, panel seals, barriers, and so forth.

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MIL-PRF-22885H

6.9 Insulation (see 3.5.2).

6.9.1 Ceramic. It is recommended that SAE AMS-I-10 grade L422 be considered for ceramic materials.

6.9.2 Thermoplastic. It is recommended that thermoplastic materials be tested in accordance with MIL-M-24519 to

the requirements specified in 3.5.2.

6.10 Rubber (see 3.5.3). It is recommended that rubber parts in accordance with A-A-59588 or SAE-AMS-R-

25988 be considered for use.

6.11 Potting compounds (see 3.5.4). It is recommended that potting compounds that meet the hydrolytic stability

requirements of MIL-PRF-8516, MIL-PRF-23586, MIL-M-24041, or MIL-I-16923 be considered for use.

6.12 Finish. It is recommended that MIL-A-8625 or MIL-C-5541 be used for meeting the requirement of this

specification for external parts finish and MIL-C-5541 be used for meeting the requirements of this specification for

internal parts finish.

6.13 Terminal finishes and platings ( see 3.6.2.1, 3.6.2.2, 3.6.2.3).

6.13.1 Gold plating. It is recommended that SAE-AMS2422, type III, class 1 be considered for meeting the gold

plating requirements of this specification.

6.13.2 Tin lead plating. It is recommended that SAE-AMS-P-81728 be considered for meeting the tin lead plating

requirements of this specification.

6.13.3 Nickel plating. It is recommended that SAE-AMS-QQ-N-290 be considered for meeting the nickel

requirements of this specification.

6.13.4 Silver plating. It is recommended that ASTM-B700 be considered for meeting the silver requirements of this

specification.

6.13.5 Hot soldering dip. It is recommended that solder dip (60-40 tin lead) in accordance with J-STD-006 be

considered for meeting the requirements of this specification.

6.14 Panel seals. It is recommended that silicone rubber be considered for meeting the requirements of this

specification.

6.15 Environmentally preferable material. Environmentally preferable materials should be used to the maximum

extent possible to meet the requirements of this specification. As of the dating of this document, the U.S.

Environmental Protection Agency (EPA) is focusing efforts on reducing 31 priority chemicals. The list of chemicals

and additional information is available on their website at https://www.epa.gov/osw/hazard/wastemin/priority.htm.

Included in the EPA list of 31 priority chemicals are cadmium, lead, and mercury. Use of these materials should be

minimized or eliminated unless needed to meet the requirements specified herein (see Section 3).

6.16 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin

whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture

and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied

over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass,

have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545

(Standard Specification for Electrodeposited Coatings of Tin).