MIL-PRF-22710H
4.5.23 Life, low level switching (see 3.26). Switches shall be tested in accordance with 4.5.23.1, as applicable.
4.5.23.1 Method II (applicable to thumbwheel and push button). Switches shall be tested in accordance with
method 206 of MIL-STD-202. An actuating mechanism shall be used that basically duplicates the function of the
mechanism described in method 206 for the switches. The following details and exception shall apply:
a. Contact load: In accordance with method 311 of MIL-STD-202. Both the normally closed and normally open
contacts shall be loaded. The similar contacts may be connected in series or individually connected to the
load, at the option of the contractor.
b. Contact resistance: The maximum contact resistance shall not exceed 1 ohm.
c. Test-condition letter: The number of operations shall be the same as shown for temperature-life
characteristics (see 3.1).
d. Operate cycle: The cycling rate shall be approximately 10 cycles per minute. The monitoring apparatus
should record the number of operating cycles. The test switches shall be manually operated at rated load,
and contact resistance readings taken at the beginning of the test and immediately following the conclusion of
each of the environments listed below, and changes in contact resistance exceeding the maximum specified
should be noted. Unless otherwise specified (see 3.1), the test shall be conducted in the following sequences
and environments:
(1) 25 percent of the test cycles at room ambient temperature.
(2) 25 percent of the test cycles at maximum rated temperature.
(3) A 2-hour noncycling period at minimum rated temperature.
(4) 25 percent of the test cycles at minimum rated temperature.
(5) 25 percent of the test cycles at room ambient temperature.
4.5.24 Solderability (see 3.27). Switches shall be tested in accordance with method 208 of MIL-STD-202, except
the dipping device need not be used. The following details shall apply:
a. Number of terminations for each part to be tested: Two.
b. Solder dip: For printed circuit board terminations, the depth of dip in flux and solder shall be sufficient to
cover the termination (approximately .375 inch (9.53 mm)).
c. Examination of terminations: Evaluation of acceptable solderability shall be in accordance with the method for
evaluation of lug and tab terminals. This evaluation shall also apply to printed circuit board terminals.
This test may be performed on two terminals on each of an equivalent number of additional printed circuit boards
identical to those incorporated into the switch being tested.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or
order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these personnel need to
contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements
are maintained by the Inventory Control Point's packaging activity within the Military Department or Defense Agency,
or within the Military Department's System Command. Packaging data retrieval is available from the managing
Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the
responsible packaging activity.
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