MIL-DTL-83731/10D
Resistive load (dc and ac): Switches shall make and break the rated resistive load for 10,000
operating cycles at room ambient pressure and a temperature of 71°C +4°C -0°C.
Inductive load (dc and ac): Switches shall make and break the rated inductive load for 10,000
operating cycles at room ambient temperature and pressure.
Lamp load: Switches shall make and break the rated lamp load for 10,000 operating cycles.
Logic level load: 10,000 cycles at an actuation rate of 10-18 cycles per minute with no "stick" or
"misses" allowed when tested in accordance with EIA 448, method 17 as follows:
Each pair of switch contacts shall be tested using a 5.0 ±0.05 V dc, 10 ± mA resistive load. During
each closure of the contacts, the voltage drop across the switch terminals shall be monitored for a
duration of no less than 50 percent of each contact static closure. The switch contacts need not
be monitored until 10 ms after the initial contact closure to exclude any contact bounce. During
each opening of the contacts, the voltage drop across the switch terminals shall be monitored for a
duration of no less than 50 percent of each contact opening.
A voltage of 2.1 volts or greater across the switch terminals shall constitute a contact "miss",
(failure to properly close the circuit). A voltage drop of less than 90 percent of the open-circuit
voltage shall constitute a contact "stick" (failure to properly open the circuit).
The monitoring device shall either record the contact closures at which "sticks" or "misses" occur,
or discontinue the test when "sticks" or "misses" occur.
Operating temperature:
a.
50 percent of the test cycle at room ambient conditions.
b.
50 percent of the test cycle at 71 +4°C or -0°C.
Short circuit: Use 100 amperes at 28 V dc.
Flux sealed: The sealing is obtained when the base is sealed to prevent flux from entering the
switch case during the wave soldering process.
Flux seal test: Three switches shall be tested as follows during qualification and group B inspection:
Measure and record initial contact resistance. Place switches, terminals down, into a shallow pan.
Pour flux at 80°F ±5°F, type RMA of ANSI J-STD-004, specific gravity 0.896, into pan without
splashing until level of flux is approximately .062 inch (1.57 mm) above the bottom of the plastic
switch case and let switches soak for ten minutes. Remove switches from flux, clean with flux
cleaning solvent and immediately put into oven for drying at 175°F for two hours. After switches
have cooled at room temperature, repeat initial measurement. Contact resistance shall not increase
by more than 10 milliohms over the initial reading. Disassemble and visually examine the contact
area for evidence of flux shall be cause for rejection.
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